Electron beam evaporation equipment (PVD 75, Kurt J. Lesker Company) bombards the target material in the crucible with focused electron beam to melt and deposit it on the substrate. This evaporation method has high alignment and can be used for high melting point target materials.It is suitable for metals and compounds with good thermal stability.

Features:

Source materials: Ti, Pt, ITO,  aluminum oxide, etc;

Chamber pressure (during evaporation): 6 x 10 ^ - 5 Torr;

At most 3 source materials are put into the equipment for evaporation at one time;

Substrate rotation: support;

Equipped with quartz crystal film thickness monitor.