Wire bonding (Ball-Wedge Bonder 5310, F&S Bondtec) is the method of making interconnections between an integrated circuit or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages.

Features:

Wire types: Al, Au wire from 17.5μm to 75 μm

Manipulator in X and Y: 18 x 18mm

Ultrasonic: F&S Generator 100kHz

Mechanical manipulator system: operator can create different kind of loops