Electron beam evaporation equipment (PVD 75, Kurt J. Lesker Company) bombards the target material in the crucible with focused electron beam to melt and deposit it on the substrate. This evaporation method has high alignment and can be used for high melting point target materials.It is suitable for metals and compounds with good thermal stability. Features:Source materials: Ti, Pt, ITO,  alumin...

Thermal evaporation system (JSD 400, JIASHUO Vacuum Technology)  directly heats and vaporizes the source material using the heat produced by a large current through the evaporation source or the source material is heated and evaporated in a tungsten boat indirectly . This method is convenient, but not suitable for high melting point and refractory materials. Features:Source materials: Au, Ag, C...

Stylus profiler (Alpha-Step D-600, KLA Tencor) supports 2D and 3D measurement of step height and roughness, as well as 2D measurement of warpage and stress. Innovative optical lever sensor technology provides high resolution measurement, large vertical range and low contact force measurement function. One advantage of the probe measurement technique is that it is a direct measurement and has no...

Wire bonding (Ball-Wedge Bonder 5310, F&S Bondtec) is the method of making interconnections between an integrated circuit or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered t...